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Ultra high vacuum sputtering system


Overview

 
Facilities

Ultrafast laser

Ultra high
vacuum
sputtering

X-Rays

AGM
Magnetometry

MOKE
Magnetometry

Magnetotransport

 
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Vacancies

Our ultra high vacuum (UHV) sputtering system has four magnetron sources that accept 2 inch diameter targets. The system may be baked to 200 ¡C during which time the pole pieces are removed from the guns. DC and RF power supplies are used to sputter both metals and insulators. Each gun has a separate crystal oscillator and the shutter plate and substrate platters are driven by computer controlled stepper motors. A further in-situ stepper motor is used to drive a shadow mask carousel, and a glow discharge is used to oxidise metal films in a controlled manner. The system can be used to fabricate an enormous variety of materials including multilayers, spin-valves, tunnel junctions, amorphous alloys and granular materials.
                                                                                                                                                                                                                                                                       

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